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Electron beam lithography (EBL) has a proven track record: e-beam systems have been used for some 30 years to produce photomasks for optical lithography in semiconductor manufacturing. However, EBL has a major problem: it is extremely slow.
Multibeam Corporation has a solution: an innovative and proprietary multi-column e-beam technology that dramatically increases wafer throughput and reduces the cost of lithography.
Multibeam achieves high throughput by optimizing the e-beam column for Complementary E-Beam Lithography (CEBL), building an array of identical columns, and combining several column-array modules into a cluster tool.
Multibeam is the technology leader in multi-column EBL, with 22 patents (15 issued). Multibeam's CEBL complements and extends optical lithography, drastically reducing the cost of patterning critical layers at advanced technology nodes in HVM.
The same multi-column technology also works for low-volume production
of ASICs, wafer defect inspection and other applications.
Multibeam Corporation is led by Dr. David K. Lam, founder and former CEO of Lam Research Corporation.
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